Solid-state image pick-up device and manufacturing method thereof, image-pickup apparatus, semiconductor device and manufacturing method thereof, and semiconductor substrate

ABSTRACT

A solid-state image pick-up device is provided which includes a semiconductor substrate main body which has an element forming layer and a gettering layer provided on an upper layer thereof; photoelectric conversion elements, each of which includes a first conductive type region, provided in the element forming layer; and a dielectric film which is provided on an upper layer of the gettering layer and which induces a second conductive type region in a surface of the gettering layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a solid-state image pick-up device anda manufacturing method thereof; an image pick-up apparatus; asemiconductor device and a manufacturing method thereof; and asemiconductor substrate. In more particular, the present inventionrelates to a solid-state image pick-up device in which a gettering layeris provided on an upper layer of an element forming layer to suppressmetal contamination and a manufacturing method of the solid-state imagepick-up device; an image pick-up apparatus; a semiconductor device and amanufacturing method thereof; and a semiconductor substrate.

2. Description of the Related Art

A thin semiconductor device having a high strength, such as a rearsurface irradiation type solid-state image pick-up device, has anelement forming layer and a wiring layer provided on one surface of theelement forming layer. In the element forming layer, photoelectricconversion elements and active elements are formed, and the activeelements convert signal charges which are photoelectric-converted by thephotoelectric conversion elements into electrical signals and output theelectrical signals. In addition, the wiring layer performs wiring of theactive elements formed in the element forming layer. Furthermore, it isconfigured such that visible light is incident on the photoelectricconversion elements from one surface of the element forming layerlocated at a side opposite to that of the wiring layer (see for example,Japanese Unexamined Patent Application Publication No. 2003-31785).

In order to optimize the spectral balance of color to the photoelectricconversion element when visible light is converted into an electricalsignal and also to form a pixel having a desired device structure from afront surface side to a rear surface side, the element forming layer ispreferably formed to have a desired small thickness. For example, in thecase of a solid-state image pick-up device in which a silicon substrateis used as the element forming layer, the thickness thereof ispreferably decreased to 10 μm or less.

As a semiconductor substrate in which elements, such as photoelectricconversion elements and active elements, are formed in athree-dimensional manner, in general, a silicon substrate having an SOIstructure is used in which an element forming layer (SOI layer) made ofsilicon is formed on a silicon substrate functioning as a supportsubstrate with a SiO₂ film (BOX layer) interposed therebetween.

Next, with reference to FIGS. 15 and 16, a related example will bedescribed in which a rear surface irradiation type solid-state imagepick-up device is formed using a semiconductor substrate which has anSOI structure.

As shown in FIG. 15, a silicon oxide film (SiO₂) 102 having a thicknessof approximately 1 μm is formed on a surface of a silicon substrate 101functioning as a support substrate, and an element forming layer 103having an SOI structure is formed on the silicon oxide film 102. Inaddition, in the element forming layer 103, there are formedphotoelectric conversion elements 104 and active elements (not shown)which convert signal charges photoelectric-converted by thephotoelectric conversion elements into electrical signals and whichoutput the above signals. Furthermore, a wiring layer 105 which performswiring of the active elements is formed on the surface of the elementforming layer 103.

In the semiconductor substrate of the solid-state image pick-up devicedescribed above, after the elements are formed in the element forminglayer 103, and the wiring layer 105 is formed, as shown in FIG. 16, thethickness of the semiconductor substrate is decreased from a rearsurface side (visible light incident side), so that only the elementforming layer 103 is allowed to remain.

In the semiconductor structure having an SOI structure described above,the silicon oxide film 102 is formed in the semiconductor substrate.Hence, when the thickness of the semiconductor substrate is decreased bywet etching, the etching can be stopped by the silicon oxide film 102.In addition, when the silicon oxide film 102 is subsequently peeledaway, only the element forming layer 103 may be allowed to remain.

However, a method for manufacturing a semiconductor substrate includinga different type of material (SiO₂), such as a semiconductor substratehaving an SOI structure, is complicated, and the product obtained by themethod described above is expensive. In addition, since a getteringlayer is not formed in the element forming layer 103, after the siliconoxide film 102 is removed, it is difficult to prevent metalcontamination caused by heavy metals in various processes.

In addition, heretofore, a technique has been proposed in which astructure having a gettering effect against metal contamination isformed in a semiconductor substrate at a rear surface side (for example,see Japanese Unexamined Patent Application Publication No. 6-61235).

However, in the case in which an insulating film is present in asubstrate as in a semiconductor substrate having an SOI structure, sincethe insulating film prevents the diffusion of metals, even when thegettering effect is imparted to a rear surface side of the semiconductorsubstrate having an SOI structure, the gettering effect described abovemay not be sufficiently obtained. In addition, in the case in which thethickness of the semiconductor substrate is decreased from a rearsurface side thereof so that only an SOI layer is allowed to remain, thegettering layer formed in the semiconductor substrate at a rear surfaceside is also removed, and hence in a process after the gettering layeris removed, no gettering effect can be obtained.

In addition, another technique is also conceived in which a getteringlayer is formed in a deep region of an SOI layer which is close to a BOXlayer. However, when the gettering layer is provided in a deep region ofthe SOI layer, in the case in which elements are formed not only in asurface region of the SOI layer but also in a region thereof in a depthdirection, degradation in element characteristics caused by crystallinedefects derived from the gettering layer may occur in some cases.

Accordingly, in order to prevent metal contamination and to suppress thedegradation in element characteristics, a technique has been proposed inwhich a gettering layer is provided between an element forming layer inwhich elements are formed and a thin film-forming removal layerlaminated on one surface of the element forming layer (see for example,Japanese Unexamined Patent Application Publication No. 2007-88450).

SUMMARY OF THE INVENTION

However, electrons and the like generated due to the presence of thegettering layer may cause noises in some cases. That is, in general, thegettering layer is a defective layer formed in a silicon single crystal,and even when a silicon substrate is metal-contaminated, the defectivelayer collects metals using heat generated in a wafer process. Hence,the influence of contamination can be suppressed in a silicon substratein which elements are formed. However, since the gettering layer isformed from a defective layer, electrons and the like generatedtherefrom as described above may adversely cause noises in some cases.Hence, as described above, it is believed that electrons and the likegenerated due to the presence of the gettering layer may cause noises.

The present invention has been conceived in consideration of theproblems described above, and it is desirable to provide a solid-stateimage pick-up device which can suppress noises generated due to thepresence of a gettering layer and a manufacturing method of thesolid-state image pick-up device; an image pick-up apparatus; asemiconductor device and a manufacturing method thereof; and asemiconductor substrate.

According to an embodiment of the present invention, there is provided asolid-state image pick-up device which includes a semiconductorsubstrate main body which includes an element forming layer and agettering layer provided on an upper layer thereof; photoelectricconversion elements, each of which includes a first conductive typeregion, provided in the element forming layer; and a dielectric filmwhich is provided on an upper layer of the gettering layer and whichinduces a second conductive type region in a surface of the getteringlayer.

According to an embodiment of the present invention, there is providedan image pick-up apparatus which includes a solid-state image pick-updevice including a semiconductor substrate main body which has anelement forming layer and a gettering layer provided on an upper layerthereof; photoelectric conversion elements, each of which includes afirst conductive type region, formed in the element forming layer; and adielectric film which is provided on an upper layer of the getteringlayer and which induces a second conductive type region in a surface ofthe gettering layer; an optical system for guiding incident light froman object to the solid-state image pick-up device; and a signalprocessing circuit for processing an output signal from the solid-stateimage pick-up device.

In addition, according to an embodiment of the present invention, thereis provided a semiconductor device which includes: a semiconductorsubstrate main body which includes an element forming layer and agettering layer provided on an upper layer of the element forming layer;a device which includes a first conductive type region and is formed inthe element forming layer; and a dielectric film which is provided on anupper layer of the gettering layer and which induces a second conductivetype region in a surface of the gettering layer.

In addition, according to an embodiment of the present invention, thereis provided a semiconductor substrate which includes: a semiconductorsubstrate main body which includes an element forming layer in which adevice including a first conductive type region is provided and agettering layer provided on an upper layer of the element forming layer;and a dielectric film which is provided on an upper layer of thegettering layer and which induced a second conductive type region in asurface of the gettering layer.

Since the second conductive type region is induced in the surface of thegettering layer by the dielectric film, even if electrons are generateddue to crystalline defects of the gettering layer, electrons and holesare combined with each other in the surface of the gettering layer, andhence electrons are not likely to enter devices, such as photoelectricconversion elements, provided in the element forming layer.

In addition, according to an embodiment of the present invention, thereis provided a solid-state image pick-up device which includes: anelement forming layer in which photoelectric conversion elements eachincluding a first conductive type region are provided; a secondconductive type impurity region provided on an upper layer of theelement forming layer; and a gettering layer provided on an upper layerof the impurity region.

In addition, according to an embodiment of the present invention, thereis provided an image pick-up apparatus which includes: a solid-stateimage pick-up device including an element forming layer in whichphotoelectric conversion elements each including a first conductive typeregion are formed, a second conductive type impurity region provided onan upper layer of the element forming layer, and a gettering layerprovided on an upper layer of the impurity region; an optical system forguiding incident light from an object to the solid-state image pick-updevice; and a signal processing circuit for processing an output signalfrom the solid-state image pick-up device.

In addition, according to an embodiment of the present invention, thereis provided a semiconductor device which includes: an element forminglayer in which a device including a first conductive type region isformed; a second conductive type impurity region provided on an upperlayer of the element forming layer; and a gettering layer provided on anupper layer of the impurity region.

In addition, according to an embodiment of the present invention, thereis provided a semiconductor substrate which includes: an element forminglayer in which a device including a first conductive type region isprovided; a second conductive type impurity region provided on an upperlayer of the element forming layer; and a gettering layer provided on anupper layer of the impurity region.

By the second conductive type impurity region provided on the upperlayer of the element forming layer, even if electrons are generated dueto crystalline defects of the gettering layer, electrons and holes arecombined with each other in the impurity region, and as a result,electrons are not likely to enter devices, such as photoelectricconversion elements, provided in the element forming layer.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body; forming agettering layer on an upper layer of the element forming layer; andforming a dielectric film on an upper layer of the gettering layer toinduce a second conductive type region in a surface thereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body whichincludes the element forming layer and a gettering layer formed on anupper layer thereof; and forming a dielectric film on an upper layer ofthe gettering layer to induce a second conductive type region in asurface thereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body; forming agettering layer between the element forming layer and a thinfilm-forming removal layer of the semiconductor substrate main body;removing the thin film-forming removal layer by etching using thegettering layer as an etching stopper; and forming a dielectric film onan upper layer of the gettering layer to induce a second conductive typeregion in a surface thereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body whichincludes the element forming layer, a gettering layer formed on an upperlayer thereof, and a thin film-forming removal layer formed on an upperlayer of the gettering layer; removing the thin film-forming removallayer by etching using the gettering layer as an etching stopper; andforming a dielectric film on the upper layer of the gettering layer toinduce a second conductive type region in a surface thereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body; forming a gettering layer on an upper layer of the elementforming layer; and forming a dielectric film on an upper layer of thegettering layer to induce a second conductive type region in a surfacethereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body which includes the element forming layer and a gettering layerformed on an upper layer thereof; and forming a dielectric film on anupper layer of the gettering layer to induce a second conductive typeregion in a surface thereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body; forming a gettering layer between the element forming layerand a thin film-forming removal layer of the semiconductor substratemain body; removing the thin film-forming removal layer by etching usingthe gettering layer as an etching stopper; and forming a dielectric filmon an upper layer of the gettering layer to induce a second conductivetype region in a surface thereof.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body which includes the element forming layer, a gettering layerformed on an upper layer thereof, and a thin film-forming removal layerformed on an upper layer of the gettering layer; removing the thinfilm-forming removal layer by etching using the gettering layer as anetching stopper; and forming a dielectric film on an upper layer of thegettering layer to induce a second conductive type region in a surfacethereof.

Since the dielectric film which induces the second conductive typeregion in the surface of the gettering layer is formed on the surface ofthe gettering layer, even if electrons are generated due to crystallinedefects of the gettering layer, electrons and holes are combined witheach other in the surface of the gettering layer, and hence electronsare not likely to enter devices, such as photoelectric conversionelements, provided in the element forming layer.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body; andforming a second conductive type impurity region on an upper layer ofthe element forming layer and forming a gettering layer on an upperlayer of the impurity region, or forming a gettering layer on an upperlayer of the element forming layer and forming a second conductive typeimpurity region between the element forming layer and the getteringlayer.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body whichincludes the element forming layer and a gettering layer formed on anupper layer thereof and forming a second conductive type impurity regionbetween the element forming layer and the gettering layer, or forming asecond conductive type impurity region between an element forming layerand a gettering layer of a semiconductor substrate main body whichincludes the element forming layer and the gettering layer formed on anupper layer thereof and forming photoelectric conversion elements, eachof which includes a first conductive type region, in the element forminglayer.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body; forming asecond conductive type impurity region between the element forming layerand a thin film-forming removal layer of the semiconductor substratemain body and forming a gettering layer between the impurity region andthe thin film-forming removal layer, or forming a gettering layerbetween the element forming layer and a thin film-forming removal layerof the semiconductor substrate main body and forming a second conductivetype impurity region between the element forming layer and the getteringlayer; and removing the thin film-forming removal layer by etching usingthe gettering layer as an etching stopper.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a solid-state image pick-updevice, which includes the steps of: forming photoelectric conversionelements, each of which includes a first conductive type region, in anelement forming layer of a semiconductor substrate main body whichincludes the element forming layer, a gettering layer formed on an upperlayer thereof, and a thin film-forming removal layer formed on an upperlayer of the gettering layer and forming a second conductive typeimpurity region between the element forming layer and the getteringlayer, or forming a second conductive type impurity region between anelement forming layer and a gettering layer of a semiconductor substratemain body which includes the element forming layer, the gettering layerformed on an upper layer thereof, and a thin film-forming removal layerformed on an upper layer of the gettering layer and formingphotoelectric conversion elements, each of which includes a firstconductive type region, in the element forming layer; and removing thethin film-forming removal layer by etching using the gettering layer asan etching stopper.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body; and forming a second conductive type impurity region on anupper layer of the element forming layer and forming a gettering layeron an upper layer of the impurity region, or forming a gettering layeron an upper layer of the element forming layer and forming a secondconductive type impurity region between the element forming layer andthe gettering layer.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body which includes the element forming layer and a gettering layerformed on an upper layer thereof and forming a second conductive typeimpurity region between the element forming layer and the getteringlayer, or forming a second conductive type impurity region between anelement forming layer and a gettering layer of a semiconductor substratemain body which includes the element forming layer and the getteringlayer formed on an upper layer thereof and forming a device including afirst conductive type region in the element forming layer.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body; forming a second conductive type impurity region between theelement forming layer and a thin film-forming removal layer of thesemiconductor substrate main body and forming a gettering layer betweenthe impurity region and the thin film-forming removal layer, or forminga gettering layer between the element forming layer and a thinfilm-forming removal layer of the semiconductor substrate main body andforming a second conductive type impurity region between the elementforming layer and the gettering layer; and removing the thinfilm-forming removal layer by etching using the gettering layer as anetching stopper.

In addition, according to an embodiment of the present invention, thereis provided a method for manufacturing a semiconductor device, whichincludes the steps of: forming a device including a first conductivetype region in an element forming layer of a semiconductor substratemain body which includes the element forming layer, a gettering layerformed on an upper layer thereof, and a thin film-forming removal layerformed on an upper layer of the gettering layer and forming a secondconductive type impurity region between the element forming layer andthe gettering layer, or forming a second conductive type impurity regionbetween an element forming layer and a gettering layer of asemiconductor substrate main body which includes the element forminglayer, the gettering layer formed on an upper layer thereof, and a thinfilm-forming removal layer formed on an upper layer of the getteringlayer and forming a device including a first conductive type region inthe element forming layer; and removing the thin film-forming removallayer by etching using the gettering layer as an etching stopper.

Since the second conductive type impurity region is formed on the upperlayer of the element forming layer, even if electrons are generated dueto crystalline defects of the gettering layer, electrons and holes arecombined with each other in the impurity region, and hence electrons arenot likely to enter devices, such as photoelectric conversion elements,provided in the element forming layer.

In the solid-state image pick-up device and the manufacturing methodthereof, the image pick-up apparatus, the semiconductor device and themanufacturing method thereof, and the semiconductor substrate, accordingto an embodiment of the present invention, noises generated by thepresence of the gettering layer can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural view illustrating a rear surfaceirradiation type solid-state image pick-up device which is one exampleof a solid-state image pick-up device according to an embodiment of thepresent invention;

FIG. 2 is a schematic view illustrating one example of a circuitstructure of a unit pixel of a pixel portion;

FIG. 3 is a schematic cross-sectional view illustrating the rear surfaceirradiation type solid-state image pick-up device which is one exampleof the solid-state image pick-up device according to an embodiment ofthe present invention;

FIG. 4 is a cross-sectional view (1) of an important part of the pixelportion of a semiconductor substrate main body;

FIGS. 5A to 5E are schematic cross-sectional views illustrating oneexample of a manufacturing method of the solid-state image pick-updevice according to an embodiment of the present invention;

FIGS. 5F to 5J are schematic cross-sectional views illustrating anotherexample of the manufacturing method of the solid-state image pick-updevice according to an embodiment of the present invention;

FIGS. 6A to 6C are schematic cross-sectional views illustrating amodified example according to a first embodiment;

FIG. 7 is a schematic cross-sectional view illustrating one example of asemiconductor device according to an embodiment of the presentinvention;

FIGS. 8A to 8D are schematic cross-sectional views illustrating oneexample of a manufacturing method of the semiconductor device accordingto an embodiment of the present invention;

FIGS. 8E to 8H are schematic cross-sectional views illustrating anotherexample of the manufacturing method of the semiconductor deviceaccording to an embodiment of the present invention;

FIG. 9 is a schematic view illustrating a camera which is one example ofan image pick-up apparatus according to an embodiment of the presentinvention;

FIG. 10 is a schematic cross-sectional view illustrating a rear surfaceirradiation type solid-state image pick-up device which is anotherexample of the solid-state image pick-up device according to anembodiment of the present invention;

FIG. 11 is a cross-sectional view (2) of an important part of a pixelportion of a semiconductor substrate main body;

FIGS. 12A to 12D are schematic cross-sectional views illustratinganother example of the manufacturing method of the solid-state imagepick-up device according to an embodiment of the present invention;

FIGS. 12E to 12H are schematic cross-sectional views illustratinganother example of the manufacturing method of the solid-state imagepick-up device according to an embodiment of the present invention;

FIG. 13 is a schematic cross-sectional view illustrating another exampleof the semiconductor device according to an embodiment of the presentinvention;

FIGS. 14A to 14D are schematic cross-sectional views illustratinganother example of the manufacturing method of the semiconductor deviceaccording to an embodiment of the present invention;

FIGS. 14E to 14H are schematic cross-sectional views illustratinganother example of the manufacturing method of the semiconductor deviceaccording to an embodiment of the present invention;

FIG. 15 is a schematic cross-sectional view (1) illustrating a relatedexample in which a rear surface irradiation type solid-state imagepick-up device is formed using a semiconductor substrate having an SOIstructure; and

FIG. 16 is a schematic cross-sectional view (2) illustrating a relatedexample in which a rear surface irradiation type solid-state imagepick-up device is formed using a semiconductor substrate having an SOIstructure.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, the best mode (hereinafter referred to as “embodiment”) forcarrying out the present invention will be described. The descriptionwill be made in the following order.

1. First embodiment (case (1) of a solid-state image pick-up device)

2. Second embodiment (case (1) of a semiconductor device)

3. Third embodiment (case of an image pick-up apparatus)

4. Fourth embodiment (case (2) of a solid-state image pick-up device)

5. Fifth embodiment (case (2) of a semiconductor device)

1. First Embodiment Structure of a Solid-State Image Pick-Up Device

FIG. 1 is a schematic structural view illustrating a rear surfaceirradiation type solid-state image pick-up device which is one exampleof a solid-state image pick-up device according to an embodiment of thepresent invention. A solid-state image pick-up device 1 of thisembodiment has a pixel portion 2 and a peripheral circuit portion, andthese portions are mounted on the same semiconductor substrate. In thefirst embodiment, the peripheral circuit portion includes a verticalselection circuit 3, a sample hold correlation double sampling (S/H·CDS)circuit 4, a horizontal selection circuit 5, a timing generator (TG) 6,an automatic gain control (AGC) circuit 7, an A/D converter circuit 8,and a digital amplifier 9.

In the pixel portion 2, many unit pixels which will be described laterare disposed in a matrix form, address lines and the like are providedon a row basis, and signal lines and the like are provided on a columnbasis.

The vertical selection circuit 3 sequentially selects pixels on a rowbasis, and signals of individual pixels are read into the S/H·CDScircuit 4 for individual pixel columns through the vertical signallines. The S/H·CDS circuit 4 performs a signal processing, such ascorrelated double sampling (CDS), on the pixel signals read from theindividual pixel columns.

The horizontal selection circuit 5 sequentially takes out the pixelsignals held in the S/H·CDS circuit 4 and output the pixel signals tothe AGC circuit 7. The AGC circuit 7 amplifies the signals input fromthe horizontal selection circuit 5 with an appropriate gain and outputsthe amplified signals to the A/D converter circuit 8.

The A/D converter circuit 8 converts the analog signals input from theAGC circuit 7 into digital signals and outputs the digital signals tothe digital amplifier 9. The digital amplifier 9 appropriately amplifiesthe digital signals input from the A/D converter circuit 8 and outputsthe amplified digital signals to pads (terminals).

The operations of the vertical selection circuit 3, the S/H·CDS circuit4, the horizontal selection circuit 5, the AGC circuit 7, the A/Dconverter circuit 8, and the digital amplifier 9 are performed based onvarious types of timing signals output from the timing generator 6.

FIG. 2 is a schematic view illustrating one example of a circuitstructure of a unit pixel of the pixel portion 2. The unit pixelincludes, for example, a photodiode 21 as a photoelectric conversionelement, and in addition, four transistors, that is, a transfertransistor 22, an amplifying transistor 23, an address transistor 24,and a reset transistor 25, are also included as active elements for thisone photodiode 21.

The photodiode 21 performs photoelectric conversion of incident lightinto charges (electrons in this case) in an amount corresponding to theamount of the incident light. The transfer transistor 22 is connectedbetween the photodiode 21 and a floating diffusion FD. In addition, whena drive signal is supplied to the gate (transfer gate) of the transfertransistor 22 through a drive wire 26, electrons which arephotoelectric-converted by the photodiode 21 are transferred to thefloating diffusion FD.

The gate of the amplifying transistor 23 is connected to the floatingdiffusion FD. The amplifying transistor 23 is connected to a verticalsignal line 27 through the address transistor 24 and forms a sourcefollower with a constant current power source I located outside thepixel portion. When an address signal is supplied to the gate of theaddress transistor 24 through a drive wire 28, and the addresstransistor 24 is turned on thereby, the amplifying transistor 23amplifies the potential of the floating diffusion FD and outputs avoltage corresponding to the amplified potential to the vertical signalline 27. The voltage output from each pixel through the vertical signalline 27 is output to the S/H·CDS circuit 4.

The reset transistor 25 is connected between a power source Vdd and thefloating diffusion FD. When a reset signal is supplied to the gate ofthe reset transistor 25 through a drive wire 29, the potential of thefloating diffusion FD is reset to a power source potential Vdd. Sincethe gates of the transfer transistors 22, the gates of the addresstransistors 24, and the gates of the reset transistors 25 arerespectively connected to each other in each row unit, the operationsdescribed above are simultaneously carried out for the pixels in onerow.

FIG. 3 is a schematic cross-sectional view illustrating the rear surfaceirradiation type solid-state image pick-up device 1 which is one exampleof the solid-state image pick-up device according to an embodiment ofthe present invention.

In the rear surface irradiation type solid-state image pick-up device, asurface (hereinafter referred to as a “rear surface” of a semiconductorsubstrate main body) opposite to a surface (hereinafter referred to as a“surface” of the semiconductor substrate main body) on which a wiringlayer 38 is formed receives light.

The solid-state image pick-up device 1 shown in FIG. 3 is primarilyformed of a semiconductor support substrate 31, a semiconductorsubstrate main body 32, a hafnium oxide film 34, a passivation film 35,a color filter 36, and a microlens 37.

Incidentally, only in a partially enlarged view, a shading film 13, thepassivation film 35, the color filter 36, and the microlens 37, whichare provided over the hafnium oxide film 34, are shown.

The semiconductor substrate main body 32 is formed of n-type silicon. Inaddition, the semiconductor substrate main body 32 has an elementforming layer 39 in which a plurality of light receiving portions 15 andactive elements (not shown), such as MOS transistors, which convertsignal charges photoelectric-converted by the light receiving portionsinto electrical signals and output these electrical signals, and thelight receiving portions 15 and the active elements form the unitpixels. Furthermore, a gettering layer 33 is formed on the elementforming layer 39 at a light incident side (rear surface side of thesemiconductor substrate main body).

In addition, the light receiving portion 15 corresponds to thephotodiode 21 shown in FIG. 2 and is formed by a pn junction in thesemiconductor substrate main body 32.

In this embodiment, the semiconductor substrate main body 32 is formedby decreasing the thickness of a silicon wafer so as to make lightincident from the rear surface.

Although the thickness of the semiconductor substrate main body 32changes depending on the type of solid-state image pick-up device, thethickness thereof is 2 to 6 μm for visible light use and is 6 to 10 μmfor infrared use.

In addition, the wiring layer 38 which performs multilayer electricalwiring of the active elements, such as MOS transistors, is formed on thesurface of the semiconductor substrate main body 32. In addition, thesemiconductor support substrate 31 is adhered to the wiring layer 38with a silicon dioxide layer 10 interposed therebetween.

The semiconductor support substrate 31 is provided to reinforce thestrength of the semiconductor substrate main body 32 and is formed, forexample, of a silicon substrate, and the thickness thereof is, forexample, approximately 725 μm.

In addition, the hafnium oxide film 34 is formed on the rear surface ofthe semiconductor substrate main body 32.

The hafnium oxide film 34 is one example of a dielectric film and placesthe surface of the gettering layer 33 and its vicinity in a positivecharge accumulation state.

Furthermore, the shading film 13 which has visible light incidentapertures 12 in regions corresponding to the light receiving portions isformed on the hafnium oxide film 34, and the passivation film 35 isformed on the shading film 13. In addition, the color filter 36 and themicrolens 37 are formed in a region corresponding to the visible lightincident aperture 12.

FIG. 4 is a cross-sectional view of an important part of the pixelportion of the semiconductor substrate main body 32.

In the region of the light receiving portion 15, an n-type chargeaccumulation region 41 is formed in the semiconductor substrate mainbody 32. In order to place the region in which signal charges are storedcloser to the surface side of the semiconductor substrate main body 32,the charge accumulation region 41 is preferably formed so that theimpurity concentration is gradually increased toward the surface side ofthe semiconductor substrate main body 32. In addition, in order toefficiently receive incident light, the charge accumulation region 41may be formed so that the area thereof is gradually increased toward therear surface side of the semiconductor substrate main body 32.

In the semiconductor substrate main body 32, a p-type well 42 is formedaround the charge accumulation region 41. In addition, in the region ofthe light receiving portion 15, a shallow p-type hole accumulationregion 44 is formed in the semiconductor substrate main body 32 at thesurface side.

In addition, an element isolation insulating film 40 made of siliconoxide is formed in the semiconductor substrate main body 32 at thesurface side. Furthermore, an n-type floating diffusion (FD) 45 isformed in the semiconductor substrate main body 32 at the surface side.

In addition, a p-type region 46 is formed between the floating diffusion45 and the charge accumulation region 41, and hence they areelectrically isolated from each other.

In this first embodiment, the case in which the gettering layer 33 isformed on the entire surface of the element forming layer 39 isdescribed by way of example. However, it is sufficient when thegettering layer 33 can suppress metal contamination, which is caused byheave metals, of devices (such as photodiodes) formed in the elementforming layer 39. Accordingly, the gettering layer 33 may not benecessarily formed on the entire surface of the element forming layer39, and as shown in FIG. 6A, the gettering layer 33 may be partiallyformed on the element forming layer 39 at the incident light side (therear surface side of the semiconductor substrate main body). However, inconsideration of the case in which the gettering layer 33 is used as anetching stopper in wet etching as describe later, the gettering layer 33is preferably formed on the entire surface of the element forming layer39.

In addition, in the first embodiment, the case in which the getteringlayer 33 is formed on the element forming layer 39 only at the lightincident side (the rear surface side of the semiconductor substrate mainbody) is described by way of example. However, as shown in FIG. 6B,besides the gettering layer formed on the element forming layer 39 atthe light incident side, gettering portions 14 may also be formed in theelement forming layer 39.

When the gettering portions 14 are formed in the element forming layer39, in order to prevent adverse influences caused by the flow ofelectrons generated due to crystalline defects of the gettering portions14 into the light receiving portion, the gettering portions 14 are eachnecessarily formed to ensure a predetermined distance from the lightreceiving portion.

Furthermore, in the first embodiment, the case in which the hafniumoxide film 34 is formed on the entire surface of the semiconductorsubstrate main body 32 is described by way of example. However, it issufficient when the hafnium oxide film 34 places the surface of thegettering layer 33 and its vicinity in a positive charge accumulationstate, and hence the hafnium oxide film 34 may not be necessarily formedover the entire surface of the semiconductor substrate main body 32.Accordingly, as shown in FIG. 6C, the hafnium oxide film 34 may also bepartially formed on an upper layer of the gettering layer 33.

In addition, in the first embodiment, although the case in which thehafnium oxide film 34 is formed is described by way of example, since itis sufficient when the surface of the gettering layer 33 and itsvicinity can be placed in a positive charge accumulation state, anotherfilm may also be used instead of the hafnium oxide film 34.

As a film having negative fixed charges, besides a hafnium oxide film,for example, an oxide insulating film made of an element selected fromzirconium, aluminum, tantalum, titanium, yttrium, and lanthanide mayalso be used.

In addition, in the first embodiment, since the light receiving portion15 (charge accumulation region 41) is an n-type region, in order toplace the surface of the gettering layer 33 and its vicinity in apositive charge accumulation state, the hafnium oxide film 34 is formedon the upper layer of the gettering layer 33. However, when the lightreceiving portion 15 is a p-type region, the surface of the getteringlayer 33 and its vicinity are preferably placed in a negative chargeaccumulation state; hence, a dielectric film which places the surface ofthe gettering layer 33 and its vicinity in a negative chargeaccumulation state is to be formed on the upper layer of the getteringlayer 33.

[Operation of the Solid-State Image Pick-Up Device]

Hereinafter, the operation of the solid-state image pick-up devicehaving the above structure will be described.

First, in a charge accumulation period, light incident from the rearsurface side of the semiconductor substrate main body 32 isphotoelectric-converted by the light receiving portion 15, and signalcharges in an amount corresponding to the amount of the incident lightare generated. The signal charges generated by the photoelectricconversion drift in the charge accumulation region 41 and are storedtherein in the vicinity of the hole accumulation region 44.

In the charge accumulation period, a negative voltage is applied to thegate electrode of the transfer transistor 22, and the transfertransistor 22 is placed in an OFF state.

Next, when a reading operation is performed, a positive voltage isapplied to the gate electrode of the transfer transistor 22, and thetransfer transistor 22 is placed in an ON state. As a result, the signalcharges stored in the light receiving portion 15 are transferred to thefloating diffusion 45.

The positive voltage is, for example, a power source voltage (3.3 V or2.7 V).

In this case, in accordance with the amount of the signal chargestransferred to the floating diffusion 45, the potential thereof changes.In addition, the potential of the floating diffusion 45 is amplified bythe amplifying transistor 23, and a voltage corresponding to theamplified potential is output to the vertical signal line 27.

Subsequently, when a reset operation is performed, a positive voltage isapplied to the gate electrode of the reset transistor 25, and thepotential of the floating diffusion 45 is reset to the voltage of thepower source Vdd. In this step, by applying a negative voltage to thegate electrode of the transfer transistor 22, the transfer transistor 22is placed in an OFF state.

The charge accumulation period, the reading operation, and the resetoperation are repeatedly performed.

[Manufacturing Method (1) of the Solid-State Image Pick-Up Device]

Hereinafter, a manufacturing method of the solid-state image pick-updevice having the above structure will be described. That is, oneexample of a manufacturing method of the solid-state image pick-updevice according to an embodiment of the present invention will bedescribed.

In a manufacturing method (1) of the solid-state image pick-up deviceaccording to an embodiment of the present invention, as shown in FIG.5A, the element isolation insulating film 40 is formed by a shallowtrench isolation (STI) technique in the semiconductor substrate mainbody 32 which includes the element forming layer 39 and a thinfilm-forming removal layer 50. Next, by ion implantation methods, then-type charge accumulation region 41, the p-type well 42, the p-typehole accumulation region 44, the floating diffusion 45, and the p-typeregion 46 are formed.

The formation order of the above regions is not particularly limited.

Subsequently, as shown in FIG. 5B, the gettering layer 33 is formedbetween the element forming layer 39 and the thin film-forming removallayer 50. In particular, for example, after boron (B) ions or phosphorus(P) ions are implanted at a high energy, the implanted impurities areactivated by a heat treatment using an arc lamp annealing device or thelike, so that the gettering layer 33 is formed.

In this manufacturing method, although the case in which after theindividual regions are formed in the element forming layer 39, thegettering layer 33 is formed is described by way of example, theindividual regions may be formed in the element forming layer 39 afterthe gettering layer 33 is formed.

In addition, although the gettering layer 33 is formed in such a waythat after boron (B) ions or phosphorus (P) ions are implanted at a highenergy, the heat treatment is performed using an arc lamp annealingdevice or the like, the method for forming the gettering layer 33 is notlimited to that described above. For example, the gettering layer 33 maybe formed in such a way that after group IV ions, such as carbon ions orSi ions, are implanted, heat diffusion is performed at approximately1,000 to 1,150° C.

Next, insulation films and wires are repeatedly formed on the surface ofthe semiconductor substrate main body 32, so that the wiring layer 38 isformed. Subsequently, the semiconductor support substrate 31 made ofsilicon is adhered to the wiring layer 38 with the silicon dioxide layer10 interposed therebetween (see FIG. 5C).

Next, as shown in FIG. 5D, the thin film-forming removal layer 50 isremoved by a wet etching method, so that the gettering layer 33 isexposed. Since an impurity region which is heavily doped withimpurities, such as boron (B) ions or phosphorus (P) ions, is able tofunction as an etching stopper, the gettering layer 33 functions as anetching stopper in the wet etching.

Subsequently, the hafnium oxide film 34 is formed on the rear surface ofthe semiconductor substrate main body 32 (see FIG. 5E).

The hafnium oxide film 34 is formed, for example, by an atomic layerdeposition method. In addition, when the hafnium oxide film 34 isformed, a silicon oxide film (not shown) having a very small thicknessis formed on the rear surface of the semiconductor substrate main body32.

Next, the shading film 13 is formed on the hafnium oxide film 34, and apattern processing is performed on the shading film 13 to form thevisible light incident apertures 12 corresponding to the light receivingportions. Furthermore, the passivation film 35 is formed on the shadingfilm 13 by a CVD method, and the color filters 36 and the microlenses 37are also formed, so that the solid-state image pick-up device shown inFIG. 3 is obtained.

Solid-state image pick-up devices comprising the semiconductor substratemain body 32 of a wafer level are separated into chips by dicing thewafer, and the chips thus separated are each processed by mounting,bonding, and sealing, so that the individual solid-state image pick-updevices can be formed.

[Manufacturing Method (2) of the Solid-State Image Pick-Up Device]

Hereinafter, another manufacturing method of the solid-state imagepick-up device having the above structure will be described. That is,another example of the manufacturing method of the solid-state imagepick-up device according to an embodiment of the present invention willbe described.

In a manufacturing method (2) of the solid-state image pick-up deviceaccording to an embodiment of the present invention, as shown in FIG.5F, when the semiconductor substrate main body 32 is manufactured, thegettering layer 33 is formed between the element forming layer 39 andthe thin film-forming removal layer 50 of the semiconductor substratemain body 32. In particular, for example, after boron (B) ions orphosphorus (P) ions are implanted at a high energy, the implantedimpurities are activated by a heat treatment using an arc lamp annealingdevice or the like, so that the gettering layer 33 is formed.

That is, in the manufacturing method (1) of the solid-state imagepick-up device according to an embodiment of the present invention, thegettering layer 33 is formed in a wafer process. On the other hand, inthe manufacturing method (2) of the solid-state image pick-up deviceaccording to an embodiment of the present invention, the gettering layer33 is formed in a substrate manufacturing process which is performedbefore a wafer process.

This method for forming the gettering layer 33 will be described withreference to a particular example.

In general, the semiconductor substrate main body 32 used for asolid-state image pick-up device is provided with an epitaxial film (notshown) thereon. In other words, the semiconductor substrate main body 32provided with an epitaxial film grown thereon is variously processed ina wafer process. In the manufacturing method (1) of the solid-stateimage pick-up device according to an embodiment of the presentinvention, since the gettering layer 33 is formed in a wafer process,after an epitaxial film is formed on the semiconductor substrate mainbody 32, the gettering layer 33 is formed. On the other hand, in themanufacturing method (2) of the solid-state image pick-up deviceaccording to an embodiment of the present invention, in order to formthe gettering layer 33 in a substrate manufacturing process, thegettering layer 33 is formed in the semiconductor substrate main body32, and an epitaxial film is then formed on the semiconductor substratemain body 32.

Next, as shown in FIG. 5G, the element isolation insulating film 40 isformed by an STI technique in the element forming layer 39 of thesemiconductor substrate main body 32. In addition, by ion implantationmethods, the n-type charge accumulation region 41, the p-type well 42,the p-type hole accumulation region 44, the floating diffusion 45, andthe p-type region 46 are formed.

The formation order of the above regions is not particularly limited.

Subsequently, insulation films and wires are repeatedly formed on thesurface of the semiconductor substrate main body 32, so that the wiringlayer 38 is formed. Next, the semiconductor support substrate 31 made ofsilicon is adhered to the wiring layer 38 with the silicon dioxide layer10 interposed therebetween (see FIG. 5H).

As shown in FIG. 5I, the thin film-forming removal layer 50 is thenremoved by a wet etching method, so that the gettering layer 33 isexposed. Since an impurity region which is heavily doped withimpurities, such as boron (B) ions or phosphorus (P) ions, is able tofunction as an etching stopper, the gettering layer 33 functions as anetching stopper in the wet etching.

Next, the hafnium oxide film 34 is formed on the rear surface of thesemiconductor substrate main body 32 (see FIG. 5J).

The hafnium oxide film 34 is formed, for example, by an atomic layerdeposition method. In addition, when the hafnium oxide film 34 isformed, a silicon oxide film (not shown) having a very small thicknessis formed on the rear surface of the semiconductor substrate main body32.

Next, the shading film 13 is formed on the hafnium oxide film 34, and apattern processing is performed on the shading film 13 to form thevisible light incident apertures 12 corresponding to the light receivingportions. Furthermore, the passivation film 35 is formed on the shadingfilm 13 by a CVD method, and the color filters 36 and the microlenses 37are also formed, so that the solid-state image pick-up device shown inFIG. 3 is obtained.

Solid-state image pick-up devices comprising the semiconductor substratemain body 32 of a wafer level are separated into chips by dicing thewafer, and the chips thus separated are each processed by mounting,bonding, and sealing, so that the individual solid-state image pick-updevices can be formed.

In this first embodiment, the case in which the thin film-formingremoval layer 50 is removed by etching using the gettering layer 33 asan etching stopper is described by way of example. However, a wetetching method may not be necessarily used as the method for removingthe thin film-forming removal layer 50, and for example, the thinfilm-forming removal layer 50 may be removed by a mechanical polishingusing a CMP method. The method for removing the thin film-formingremoval layer 50 described above may be applied to both themanufacturing methods (1) and (2) of the solid-state image pick-updevice according to an embodiment of the present invention.

In addition, in the first embodiment, the gettering layer 33 is formedbetween the element forming layer 39 and the thin film-forming removallayer 50, and the thin film-forming removal layer 50 is then removed, sothat the gettering layer 33 is exposed. However, it is sufficient whenthe gettering layer 33 can be formed on the upper layer (incident lightside) of the element forming layer 39, and hence the gettering layer 33may be formed on the upper layer (incident light side) of the elementforming layer 39 by using the semiconductor substrate main body 32including no thin film-forming removal layer 50. However, since thesemiconductor substrate main body 32 including no thin film-formingremoval layer 50 has a thickness of approximately 10 μm, it is believedthat the handling of the semiconductor substrate main body 32 isconsiderably difficult in a manufacturing process. Hence, inconsideration of the convenience of handling the semiconductor substratemain body 32 in a manufacturing process, it may be preferable that afterthe semiconductor substrate main body 32 having the thin film-formingremoval layer 50 is used and is then adhered to the semiconductorsupport substrate 31, the thin film-forming removal layer 50 be removed.The method for forming the gettering layer 33 described above may beapplied to both the manufacturing methods (1) and (2) of the solid-stateimage pick-up device according to an embodiment of the presentinvention.

In the example of the solid-state image pick-up device according to anembodiment of the present invention, since the gettering layer 33 isformed, metal contamination caused by heavy metals can be prevented invarious processes after the thin film-forming removal layer 50 isremoved.

In addition, since the hafnium oxide film 34 is formed on the upperlayer of the gettering layer 33, electrons generated due to crystallinedefects of the gettering layer 33 are suppressed from flowing into thelight receiving portion. In particular, the hafnium oxide film 34 has anegative fixed charge therein, and because of this negative fixedcharge, the surface of the gettering layer 33 and its vicinity areplaced in a positive charge accumulation state. Hence, even if electronsare generated due to crystalline defects of the gettering layer 33, theelectrons thus generated can be combined with holes in the region placedin the positive charge accumulation state, and as a result, theelectrons are suppressed from flowing into the light receiving portion.Accordingly, noises of the solid-state image pick-up device are reduced,and the S/N ratio of the device can be improved.

In addition, since electrons are suppressed from flowing into the lightreceiving portion by the hafnium oxide film 34, the degree of devicedesign freedom can be increased, and the device characteristics can alsobe improved.

In particular, for example, according to the technique disclosed inJapanese Unexamined Patent Application Publication No. 2007-88450, inorder to suppress noises caused by crystalline defects of the getteringlayer, a hole accumulation region, which is a p-type region, is formedin the element forming layer at an incident light side (rear surfaceside of the semiconductor substrate main body). However, since the holeaccumulation region is formed as described above, the degree of devicedesign freedom is decreased, and in addition, since the area for formingthe light receiving portion is reduced, the device characteristics aredegraded. On the other hand, when electrons are suppressed from flowinginto the light receiving portion by the hafnium oxide film 34, the holeaccumulation region may not be necessarily formed in the element forminglayer 39, and as described above, the degree of device design freedom isincreased, and the device characteristics can also be improved.

Furthermore, since the hafnium oxide film 34 also functions as anantireflection film, when the hafnium oxide film 34 is formed, anantireflection film may not be additionally formed.

2. Second Embodiment Structure of a Semiconductor Device

FIG. 7 is a schematic cross-sectional view illustrating one example of asemiconductor device according to an embodiment of the presentinvention. A semiconductor device 60 shown in this embodiment is, forexample, RAM, ROM, or LSI and is primarily formed of a semiconductorsupport substrate 61, a semiconductor substrate main body 62, and ahafnium oxide film 63.

The semiconductor substrate main body 62 is formed of n-type silicon. Inaddition, the semiconductor substrate main body 62 has an elementforming layer 65 in which n-type devices 64, such as a logic element, anactive element, and a passive element, are formed. Furthermore, agettering layer 66 is formed on the element forming layer 65.

Although the thickness of the semiconductor substrate main body 62changes depending on the type of semiconductor device, the thicknessnecessary for forming a device is approximately 10 μm.

In addition, a wiring layer 67 performing multilayer electrical wiringof the devices 64 is formed on one surface (surface indicated by themark A) of the semiconductor substrate main body 62. In addition, thesemiconductor support substrate 61 is adhered to the wiring layer 67with a silicon dioxide layer 68 interposed therebetween.

The semiconductor support substrate 61 is provided to reinforce thestrength of the semiconductor substrate main body 62 and is formed, forexample, of a silicon substrate, and the thickness thereof is forexample, approximately 725 μm.

In addition, the hafnium oxide film 63 is formed on the other surface(surface indicated by the mark B) of the semiconductor substrate mainbody 62.

In this embodiment, as in the case of the first embodiment describedabove, the gettering layer 66 may not be necessarily formed on theentire surface of the element forming layer 65 and may be partiallyformed thereon. However, in consideration of the case in which thegettering layer 66 is used as an etching stopper in wet etching asdescribe later, the gettering layer 66 is preferably formed on theentire surface of the element forming layer 65.

In addition, as in the first embodiment described above, getteringportions may also be formed in the element forming layer 65 besides thegettering layer 66 formed on the element forming layer 65. However, whenelectrons generated due to crystalline defects of the gettering portionsformed in the element forming layer 65 may adversely influence thedevices in some cases, the gettering portions are each necessarilyformed to ensure a predetermined distance from the devices.

Furthermore, as in the first embodiment, when the surface of thegettering layer 66 and its vicinity can be placed in a positive chargeaccumulation state, the hafnium oxide film 63 may not be necessarilyformed on the entire surface of the semiconductor substrate main body62. In addition, also as in the first embodiment, when the surface ofthe gettering layer 66 and its vicinity can be placed in a positivecharge accumulation state, another film may also be used instead of thehafnium oxide film 63.

In the second embodiment, since the devices 64 are each an n type, thehafnium oxide film 63 is formed on an upper layer of the gettering layer66 in order to place the surface of the gettering layer 66 and itsvicinity in a positive charge accumulation state. However, when thedevices 64 are each a p type, since the surface of the gettering layer66 and its vicinity are necessarily placed in a negative chargeaccumulation state, a dielectric film which can place the surface of thegettering layer 66 and its vicinity in a negative charge accumulationregion is formed on the upper layer of the gettering layer 66.

[Manufacturing Method (1) of the Semiconductor Device]

Hereinafter, a manufacturing method of the semiconductor device havingthe above structure will be described. That is, one example of a methodfor manufacturing the semiconductor device according to an embodiment ofthe present invention will be described.

In a method (1) for manufacturing the semiconductor device according toan embodiment of the present invention, as shown in FIG. 8A, the device64 is formed in the semiconductor substrate main body 62 which includesthe element forming layer 65 and a thin film-forming removal layer 70.

Subsequently, as shown in FIG. 8B, the gettering layer 66 is formedbetween the element forming layer 65 and the thin film-forming removallayer 70. In particular, for example, after boron (B) ions or phosphorus(P) ions are implanted at a high energy, the implanted impurities areactivated by a heat treatment using an arc lamp annealing device or thelike, so that the gettering layer 66 is formed.

In this embodiment, although the case in which after the device 64 isformed in the element forming layer 65, the gettering layer 66 is formedis described by way of example, the device 64 may be formed in theelement forming layer 65 after the gettering layer 66 is formed.

In addition, although the gettering layer 66 is formed in such a waythat after boron (B) ions or phosphorus (P) ions are implanted at a highenergy, the heat treatment is performed using an arc lamp annealingdevice or the like, the method for forming the gettering layer 66 is notlimited to that described above. For example, the gettering layer 66 maybe formed in such a way that after group IV ions, such as carbon ions orSi ions, are implanted, heat diffusion is performed at approximately1,000 to 1,150° C.

Next, insulation films and wires are repeatedly formed on one surface ofthe semiconductor substrate main body 62, so that the wiring layer 67 isformed. Subsequently, the semiconductor support substrate 61 made ofsilicon is adhered to the wiring layer 67 with the silicon dioxide layer68 interposed therebetween (see FIG. 8C).

Subsequently, as shown in FIG. 8D, the thin film-forming removal layer70 is removed by a wet etching method, so that the gettering layer 66 isexposed. In this wet etching, the gettering layer 66 functions as anetching stopper.

Next, the hafnium oxide film 63 is formed on the other surface of thesemiconductor substrate main body 62, so that the semiconductor deviceshown in FIG. 7 can be obtained. In this case, the hafnium oxide film 63may be formed, for example, by an atomic layer deposition method.

Semiconductor devices comprising the semiconductor substrate main body62 of a wafer level are separated into chips by dicing the wafer, andthe chips thus separated are each processed by mounting, bonding, andsealing, so that the individual semiconductor devices can be formed.

[Manufacturing Method (2) of the Semiconductor Device]

Hereinafter, another method for manufacturing the semiconductor devicehaving the above structure will be described. That is, another exampleof the method for manufacturing the semiconductor device according to anembodiment of the present invention will be described.

In a method (2) for manufacturing the semiconductor device according toan embodiment of the present invention, as shown in FIG. 8E, when thesemiconductor substrate main body 62 is formed, the gettering layer 66is formed between the element forming layer 65 and the thin film-formingremoval layer 70 of the semiconductor substrate main body 62. Inparticular, for example, after boron (B) ions or phosphorus (P) ions areimplanted at a high energy, the implanted impurities are activated by aheat treatment using an arc lamp annealing device or the like, so thatthe gettering layer 66 is formed.

That is, in the method (1) for manufacturing the semiconductor deviceaccording to an embodiment of the present invention, the gettering layer66 is formed in a wafer process. On the other hand, in the method (2)for manufacturing the semiconductor device according to an embodiment ofthe present invention, the gettering layer 66 is formed in a substratemanufacturing process which is performed before a wafer process.

This method for forming the gettering layer 66 will be described withreference to a particular example.

In general, the semiconductor substrate main body 62 used for asemiconductor device is provided with an epitaxial film (not shown)thereon. In other words, the semiconductor substrate main body 62provided with an epitaxial film formed thereon is variously processed ina wafer process. In the manufacturing method (1) of the semiconductordevice according to an embodiment of the present invention, in order toform the gettering layer 66 in a wafer process, after an epitaxial filmis formed on the semiconductor substrate main body 62, the getteringlayer 66 is formed. On the other hand, in the manufacturing method (2)of the semiconductor device according to an embodiment of the presentinvention, in order to form the gettering layer 66 in a substratemanufacturing process, the gettering layer 66 is formed in thesemiconductor substrate main body 62, and an epitaxial film is thenformed on the semiconductor substrate main body 62.

Subsequently, as shown in FIG. 8F, the device 64 is formed in theelement forming layer 65 of the semiconductor substrate main body 62.

Next, insulation films and wires are repeatedly formed on one surface ofthe semiconductor substrate main body 62, so that the wiring layer 67 isformed. The semiconductor support substrate 61 made of silicon is thenadhered to the wiring layer 67 with the silicon dioxide layer 68interposed therebetween (see FIG. 8G).

Subsequently, as shown in FIG. 8H, the thin film-forming removal layer70 is removed by a wet etching method, so that the gettering layer 66 isexposed. In this wet etching, the gettering layer 66 functions as anetching stopper.

Next, the hafnium oxide film 63 is formed on the other surface of thesemiconductor substrate main body 62, so that the semiconductor deviceshown in FIG. 7 can be obtained. In this case, the hafnium oxide film 63may be formed, for example, by an atomic layer deposition method.

Semiconductor devices comprising the semiconductor substrate main body62 of a wafer level are separated into chips by dicing the wafer, andthe chips thus separated are each processed by mounting, bonding, andsealing, so that the individual semiconductor devices can be formed.

In this embodiment, as the method for removing the thin film-formingremoval layer 70, a wet etching method may not be necessarily used. Forexample, the thin film-forming removal layer 70 may be removed bymechanical polishing using a CMP method, and as in the first embodimentdescribed above, this method may be applied to both the manufacturingmethods (1) and (2) of the semiconductor device according to anembodiment of the present invention.

In the example of the semiconductor device according to an embodiment ofthe present invention, since the gettering layer 66 is formed, after thethin film-forming removal layer 70 is removed, metal contaminationcaused by heavy metals can be prevented in various processes.

In addition, since the hafnium oxide film 63 is formed on the upperlayer of the gettering layer 66, electrons generated due to crystallinedefects of the gettering layer 66 are suppressed from flowing into thedevice. In particular, the hafnium oxide film 63 has a negative fixedcharge therein, and because of the negative fixed charge, the surface ofthe gettering layer 66 and its vicinity are placed in a positive chargeaccumulation state. Hence, even if electrons are generated due tocrystalline defects of the gettering layer 66, the electrons thusgenerated can be combined with holes in the region placed in a positivecharge accumulation state, and as a result, the electrons are suppressedfrom flowing into the device. Accordingly, noises of the semiconductordevice are reduced.

In addition, since electrons are suppressed from flowing into the deviceby the hafnium oxide film 63, the degree of device design freedom can beincreased, and the device characteristics can also be improved.

In particular, for example, according to the technique disclosed inJapanese Unexamined Patent Application Publication No. 2007-88450, inorder to suppress noises caused by crystalline defects of the getteringlayer, the hole accumulation region, which is a p-type region, is formedin the element forming layer. However, since the hole accumulationregion as described above is necessarily formed, the degree of devicedesign freedom is decreased, and in addition, since the area for formingthe device is reduced, the device characteristics are degraded. On theother hand, when electrons are suppressed from flowing into the deviceby the hafnium oxide film 63, the hole accumulation region may not benecessarily formed in the element forming layer 65, and as describedabove, the degree of device design freedom is increased, and the devicecharacteristics are also improved.

3. Third Embodiment Structure of a Camera

FIG. 9 is a schematic view illustrating a camera 77 which is one exampleof an image pick-up apparatus according to an embodiment of the presentinvention. In this embodiment, the camera 77 thus shown uses thesolid-state image pick-up device according to the first embodimentdescribed above as an image pick-up device.

In the camera 77 using the solid-state image pick-up device according tothe first embodiment of the present invention, light from an object (notshown) is incident on an image pick-up area of a solid-state imagepick-up device 73 through an optical system, such as a lens 71, and amechanical shutter 72. The mechanical shutter 72 blocks light incidenton the image pick-up area of the solid-state image pick-up device 73 anddetermines an exposure time.

The solid-state image pick-up device 1 according to the first embodimentis used as the solid-state image pick-up device 73, and the solid-stateimage pick-up device 73 is driven by a drive circuit 74 including atiming generation circuit and a drive system.

In addition, an output signal of the solid-state image pick-up device 73is processed by various signal processings by the following signalprocessing circuit 75 and is then sent outside as an image pick-upsignal, and the image pick-up signal thus sent is stored in a recordingmedium, such as a memory, or is output to a monitor.

In addition, open and close control of the mechanical shutter 72,control of the drive circuit 74, control of the signal processingcircuit 75, and the like are performed by a system controller 76.

Since the camera 77 described above uses the solid-state image pick-updevice 1 according to the first embodiment of the present invention,metal contamination caused by heavy metals can be prevented in variousprocesses, and hence a high-quality pickup image can be obtained.

In addition, since the hafnium oxide film 34 is formed on the upperlayer of the gettering layer 33, electrons generated due to crystallinedefects of the gettering layer 33 can be suppressed from flowing intothe light receiving portion. Hence, noises of the solid-state imagepick-up device can be reduced, and the S/N ratio of the device can beimproved, so that a high-quality pickup image can be obtained.

Furthermore, since electrons can be suppressed by the hafnium oxide film34 from flowing into the light receiving portion, the devicecharacteristics can be improved, and as a result, a high-quality pickupimage can be obtained.

Modified Example

In addition, in the third embodiment, although the case in which thesolid-state image pick-up device according to the first embodiment isused as an image pick-up device is described by way of example, as theimage pick-up device, a solid-state image pick-up device according tothe following fourth embodiment may also be used.

4. Fourth Embodiment Structure of a Solid-State Image Pick-Up Device

As in the first embodiment, a rear surface irradiation type solid-stateimage pick-up device 1 which is another example of the solid-state imagepick-up device according to an embodiment of the present invention hasthe pixel portion 2 and the peripheral circuit portion, and theseportions are mounted on the same semiconductor substrate. In the fourthembodiment, the peripheral circuit portion includes the verticalselection circuit 3, the S/H·CDS circuit 4, the horizontal selectioncircuit 5, the TG 6, the AGC circuit 7, the A/D converter circuit 8, andthe digital amplifier 9 (see FIG. 1).

In the pixel portion 2, many unit pixels are disposed in a matrix form,address lines and the like are provided on a row basis, and signal linesand the like are provided on a column basis. The structure describedabove is the same as that in the first embodiment.

The vertical selection circuit 3 sequentially selects pixels on a rowbasis, and signals of individual pixels are read into the S/H·CDScircuit 4 for individual pixel columns through the vertical signallines. The S/H·CDS circuit 4 performs a signal processing, such as CDS,on the pixel signals read from the individual pixel columns. Thestructure described above is also the same as that in the firstembodiment.

The horizontal selection circuit 5 sequentially takes out the pixelsignals held in the S/H·CDS circuit 4 and output the pixel signals tothe AGC circuit 7. The AGC circuit 7 amplifies the signals input fromthe horizontal selection circuit 5 with an appropriate gain and outputsthe amplified signals to the A/D converter circuit 8. The structuredescribed above is also the same as that in the first embodiment.

The A/D converter circuit 8 converts the analog signals input from theAGC circuit 7 into digital signals and outputs the digital signals tothe digital amplifier 9. The digital amplifier 9 appropriately amplifiesthe digital signals input from the A/D converter circuit 8 and outputsthe amplified digital signals to pads (terminals). The structuredescribed above is also the same as that in the first embodiment.

The operations of the vertical selection circuit 3, the S/H·CDS circuit4, the horizontal selection circuit 5, the AGC circuit 7, the A/Dconverter circuit 8, and the digital amplifier 9 are performed based onvarious types of timing signals output from the timing generator 6. Thestructure described above is also the same as that in the firstembodiment.

The unit pixel forming the pixel portion 2 includes, for example, thephotodiode 21 as a photoelectric conversion element, and fourtransistors, that is, the transfer transistor 22, the amplifyingtransistor 23, the address transistor 24, and the reset transistor 25,are also included as active elements for this one photodiode 21 (seeFIG. 2).

The photodiode 21 performs photoelectric conversion of incident lightinto charges (electrons in this case) in an amount corresponding to theamount of the incident light. The transfer transistor 22 is connectedbetween the photodiode 21 and the floating diffusion FD. In addition,when a drive signal is supplied to the gate (transfer gate) of thetransfer transistor 22 through the drive wire 26, electrons which arephotoelectric-converted in the photodiode 21 are transferred to thefloating diffusion FD. The structure described above is also the same asthat in the first embodiment.

The gate of the amplifying transistor 23 is connected to the floatingdiffusion FD. The amplifying transistor 23 is connected to the verticalsignal line 27 through the address transistor 24 and forms the sourcefollower with the constant current power source I located outside thepixel portion. When an address signal is supplied to the gate of theaddress transistor 24 through the drive wire 28, and the addresstransistor 24 is turned on thereby, the amplifying transistor 23amplifies the potential of the floating diffusion FD and outputs avoltage corresponding to the amplified potential to the vertical signalline 27. The voltage output from each pixel through the vertical signalline 27 is output to the S/H·CDS circuit 4. The structure describedabove is also the same as that in the first embodiment.

The reset transistor 25 is connected between the power source Vdd andthe floating diffusion FD. When a reset signal is supplied to the gateof the reset transistor 25 through the drive wire 29, the potential ofthe floating diffusion FD is reset to the power source potential Vdd.Since the gates of the transfer transistors 22, the gates of the addresstransistors 24, and the gates of the reset transistors 25 arerespectively connected to each other in each row unit, the operationsdescribed above are simultaneously carried out for the pixels in onerow. The structure described above is also the same as that in the firstembodiment.

FIG. 10 is a schematic cross-sectional view illustrating the rearsurface irradiation type solid-state image pick-up device which isanother example of the solid-state image pick-up device according to anembodiment of the present invention.

The solid-state image pick-up device 1 shown in FIG. 10 is primarilyformed of the semiconductor support substrate 31, the semiconductorsubstrate main body 32, the passivation film 35, the color filter 36,and the microlens 37.

Incidentally, only in a partially enlarged view, the shading film 13,the passivation film 35, the color filter 36, and the microlens 37,which are provided over the semiconductor substrate main body 32, areshown.

The semiconductor substrate main body 32 is formed of n-type silicon. Inaddition, the semiconductor substrate main body 32 has the elementforming layer 39 in which a plurality of the light receiving portions 15and active elements (not shown), such as MOS transistors, which convertsignal charges photoelectric-converted by the light receiving portionsinto electrical signals and output these electrical signals are formed,and the light receiving portions 15 and the active elements form theunit pixels. Furthermore, a p⁺ layer 84 which is an impurity region isformed on the element forming layer 39 at a light incident side (rearsurface side of the semiconductor substrate main body), and a getteringlayer 83 is formed on the p⁺ layer 84 at a light incident side (rearsurface side of the semiconductor substrate main body).

In addition, the light receiving portion 15 corresponds to thephotodiode 21 shown in FIG. 2 and is formed of a pn junction in thesemiconductor substrate main body 32. In addition, the p⁺ layer 84 isone example of a second conductive type impurity region.

In this embodiment, the semiconductor substrate main body 32 is formedby decreasing the thickness of a silicon wafer so as to make lightincident from the rear surface.

Although the thickness of the semiconductor substrate main body 32changes depending on the type of solid-state image pick-up device, thethickness thereof is 2 to 6 μm for visible light use and is 6 to 10 μmfor infrared use.

In addition, the wiring layer 38 performing multilayer electrical wiringof the active elements, such as MOS transistors, is formed on thesurface of the semiconductor substrate main body 32. In addition, thesemiconductor support substrate 31 is adhered to the wiring layer 38with the silicon dioxide layer 10 interposed therebetween.

The semiconductor support substrate 31 is provided to reinforce thestrength of the semiconductor substrate main body 32 and is formed, forexample, of a silicon substrate, and the thickness thereof is, forexample, approximately 725 μm.

In addition, the shading film 13 which has the visible light incidentapertures 12 in regions corresponding to the light receiving portions isformed on an upper layer of the semiconductor substrate main body 32,and the passivation film 35 is formed on an upper layer of the shadingfilm 13. In addition, the color filter 36 and the microlens 37 areformed in a region corresponding to the visible light incident aperture12.

FIG. 11 is a cross-sectional view showing an important part of the pixelportion of the semiconductor substrate main body 32.

In the region of the light receiving portion 15, the n-type chargeaccumulation region 41 is formed in the semiconductor substrate mainbody 32. In order to place the region in which signal charges are storedcloser to the surface side of the semiconductor substrate main body 32,the charge accumulation region 41 is preferably formed so that theimpurity concentration is gradually increased toward the surface side ofthe semiconductor substrate main body 32. In addition, in order toefficiently receive incident light, the charge accumulation region 41may be formed so that the area thereof is gradually increased toward therear surface side of the semiconductor substrate main body 32.

In the semiconductor substrate main body 32, the p-type well 42 isformed around the charge accumulation region 41. In addition, in theregion of the light receiving portion 15, the shallow p-type holeaccumulation region 44 is formed in the semiconductor substrate mainbody 32 at the surface side.

In addition, the element isolation insulating film 40 made of siliconoxide is formed in the semiconductor substrate main body 32 at thesurface side. Furthermore, the n-type floating diffusion (FD) 45 isformed in the semiconductor substrate main body 32 at the surface side.

The p-type region 46 is formed between the floating diffusion 45 and thecharge accumulation region 41, and hence they are electrically isolatedfrom each other.

In this fourth embodiment, the case in which the gettering layer 83 isformed on the entire surface of the p⁺ layer 84 is described by way ofexample. However, it is sufficient when the gettering layer 83 cansuppress metal contamination, which is caused by heavy metals, of adevice (such as a photodiode) formed in the element forming layer 39.Accordingly, the gettering layer 83 may not be necessarily formed on theentire surface of the p⁺ layer 84 and may be partially formed at theincident light side (the rear surface side of the semiconductorsubstrate main body) of the element forming layer 39. However, inconsideration of the case in which the gettering layer 83 is used as anetching stopper in wet etching as describe later, the gettering layer 83is preferably formed on the entire surface of the p⁺ layer 84.

In addition, in the fourth embodiment, the case in which the getteringlayer 83 is formed only at the light incident side (the rear surfaceside of the semiconductor substrate main body) of the element forminglayer 39 is described by way of example. However, besides the getteringlayer 83 formed at the light incident side of the element forming layer39, the gettering portions (not shown) may also be formed in the elementforming layer 39.

When the gettering portions are formed in the element forming layer 39,in order to prevent adverse influences caused by the flow of electronsgenerated due to crystalline defects of the gettering portions into thelight receiving portion, the gettering portions are each necessarilyformed to ensure a predetermined distance from the light receivingportion.

Furthermore, in the fourth embodiment, the case in which the p⁺ layer 84is formed on the entire surface of the element forming layer 39 isdescribed by way of example. However, it is sufficient when the p⁺ layer84 is provided in the vicinity of the light receiving portion 15, andhence the p⁺ layer 84 may not be necessarily formed on the entiresurface of the element forming layer 39.

In addition, in the fourth embodiment, since the light receiving portion15 (charge accumulation region 41) is an n-type region, the p⁺ layer 84,which is a p-type impurity region, is formed. However, when the lightreceiving portion 15 (charge accumulation region 41) is a p-type region,an n⁺ layer, which is an n⁺-type impurity region, is to be formed.

[Operation of the Solid-State Image Pick-Up Device]

Hereinafter, the operation of the solid-state image pick-up devicehaving the above structure will be described.

First, in a charge accumulation period, light incident from the rearsurface side of the semiconductor substrate main body 32 isphotoelectric-converted by the light receiving portion 15, and signalcharges in an amount corresponding to the amount of the incident lightis generated. The signal charges generated by the photoelectricconversion drift in the charge accumulation region 41 and are storedtherein in the vicinity of the hole accumulation region 44.

In the charge accumulation period, a negative voltage is applied to thegate electrode of the transfer transistor 22, and the transfertransistor 22 is placed in an OFF state.

Next, when a reading operation is performed, a positive voltage isapplied to the gate electrode of the transfer transistor 22, and thetransfer transistor 22 is placed in an ON state. As a result, the signalcharges stored in the light receiving portion 15 are transferred to thefloating diffusion 45.

The positive voltage is, for example, a power source voltage (3.3 V or2.7 V).

In this case, in accordance with the amount of the signal chargestransferred to the floating diffusion 45, the potential thereof changes.In addition, the potential of the floating diffusion 45 is amplified bythe amplifying transistor 23, and a voltage corresponding to theamplified potential is output to the vertical signal line 27.

Subsequently, when a reset operation is performed, a positive voltage isapplied to the gate electrode of the reset transistor 25, and thepotential of the floating diffusion 45 is reset to the voltage of thepower source Vdd. In this step, by applying a negative voltage to thegate electrode of the transfer transistor 22, the transfer transistor 22is placed in an OFF state.

The charge accumulation period, the reading operation, and the resetoperation are repeatedly performed.

[Manufacturing Method (3) of the Solid-State Image Pick-Up Device]

Hereinafter, a manufacturing method of the solid-state image pick-updevice having the above structure will be described. That is, anotherexample of the manufacturing method of the solid-state image pick-updevice according to an embodiment of the present invention will bedescribed.

In a manufacturing method (3) of the solid-state image pick-up deviceaccording to an embodiment of the present invention, as shown in FIG.12A, the element isolation insulating film 40 is formed by a STItechnique in the semiconductor substrate main body 32 which includes theelement forming layer 39 and the thin film-forming removal layer 50.Next, by ion implantation methods, the n-type charge accumulation region41, the p-type well 42, the p-type hole accumulation region 44, thefloating diffusion 45, and the p-type region 46 are formed.

The formation order of the above regions is not particularly limited.

Subsequently, as shown in FIG. 12B, the p⁺ layer 84 is formed in theelement forming layer 39 at a side of the thin film-forming removallayer 50. In particular, for example, phosphorus (P) ions are implantedat a high energy, so that the p⁺ layer 84 is formed. In addition, asshown in FIG. 12B, the gettering layer 83 is formed in the p⁺ layer 84at the thin film-forming removal layer 50 side. In particular, forexample, after boron (B) ions or phosphorus (P) ions are implanted at ahigh energy, the implanted impurities are activated by a heat treatmentusing an arc lamp annealing device or the like, so that the getteringlayer 83 is formed.

In this manufacturing method, although the case in which after theindividual regions are formed in the element forming layer 39, the p⁺layer 84 and the gettering layer 83 are formed is described by way ofexample, the individual regions may be formed in the element forminglayer 39 after the p⁺ layer 84 and the gettering layer 83 are formed.

In addition, although the case in which after the p⁺ layer 84 is formed,the gettering layer 83 is formed is described by way of example, the p⁺layer 84 may be formed after the gettering layer 83 is formed.

In addition, although the gettering layer 83 is formed in such a waythat after boron (B) ions or phosphorus (P) ions are implanted at a highenergy, the heat treatment is performed using an arc lamp annealingdevice or the like, the method for forming the gettering layer 83 is notlimited to that described above. For example, the gettering layer 83 maybe formed in such a way that after group IV ions, such as carbon ions orSi ions, are implanted, heat diffusion is performed at approximately1,000 to 1,150° C.

Next, insulation films and wires are repeatedly formed on the surface ofthe semiconductor substrate main body 32, so that the wiring layer 38 isformed. Subsequently, the semiconductor support substrate 31 made ofsilicon is adhered to the wiring layer 38 with the silicon dioxide layer10 interposed therebetween (see FIG. 12C).

Subsequently, as shown in FIG. 12D, the thin film-forming removal layer50 is removed by a wet etching method, so that the gettering layer 83 isexposed. Since an impurity region which is heavily doped withimpurities, such as boron (B) ions or phosphorus (P) ions, is able tofunction as an etching stopper, the gettering layer 83 functions as anetching stopper in the wet etching.

Next, the shading film 13 is formed on the semiconductor substrate mainbody 32, and a pattern processing is performed on the shading film 13 toform the visible light incident apertures 12 corresponding to the lightreceiving portions. Furthermore, the passivation film 35 is formed onthe shading film 13 by a CVD method, and the color filters 36 and themicrolenses 37 are also formed, so that the solid-state image pick-updevice shown in FIG. 10 can be obtained.

Solid-state image pick-up devices comprising the semiconductor substratemain body 32 of a wafer level are separated into chips by dicing thewafer, and the chips thus separated are each processed by mounting,bonding, and sealing, so that the individual solid-state image pick-updevices can be formed.

[Manufacturing Method (4) of the Solid-State Image Pick-Up Device]

Hereinafter, another method for manufacturing the solid-state imagepick-up device having the above structure will be described. That is,another example of the method for manufacturing the solid-state imagepick-up device according to an embodiment of the present invention willbe described.

In a method (4) for manufacturing the solid-state image pick-up deviceaccording to an embodiment of the present invention, as shown in FIG.12E, when the semiconductor substrate main body 32 is formed, thegettering layer 83 is formed between the element forming layer 39 andthe thin film-forming removal layer 50 of the semiconductor substratemain body 32. In particular, for example, after boron (B) ions orphosphorus (P) ions are implanted at a high energy, the implantedimpurities are activated by a heat treatment using an arc lamp annealingdevice or the like, so that the gettering layer 83 is formed.

That is, in the method (3) for manufacturing the solid-state imagepick-up device according to an embodiment of the present invention, thegettering layer 83 is formed in a wafer process. On the other hand, inthe method (4) for manufacturing the solid-state image pick-up deviceaccording to an embodiment of the present invention, the gettering layer83 is formed in a substrate manufacturing process which is performedbefore a wafer process.

This method for forming the gettering layer 83 will be described withreference to a particular example.

In general, the semiconductor substrate main body 32 used for asolid-state image pick-up device is provided with an epitaxial film (notshown) thereon. In other words, the semiconductor substrate main body 32provided with an epitaxial film grown thereon is variously processed ina wafer process. In the manufacturing method (3) of the solid-stateimage pick-up device according to an embodiment of the presentinvention, since the gettering layer 83 is formed in a wafer process,after an epitaxial film is formed on the semiconductor substrate mainbody 32, the gettering layer 83 is formed. On the other hand, in themanufacturing method (4) of the solid-state image pick-up deviceaccording to an embodiment of the present invention, since the getteringlayer 83 is formed in a substrate manufacturing process, the getteringlayer 83 is formed in the semiconductor substrate main body 32, and anepitaxial film is then formed on the semiconductor substrate main body32.

Subsequently, as shown in FIG. 12F, the element isolation insulatingfilm 40 is formed by a STI technique in the element forming layer 39 ofthe semiconductor substrate main body 32. In addition, by ionimplantation methods, the n-type charge accumulation region 41, thep-type well 42, and the p-type hole accumulation region 44, the floatingdiffusion 45, and the p-type region 46 are formed.

The formation order of the above regions is not particularly limited.

Furthermore, as shown in FIG. 12F, the p⁺ layer 84 is formed between theelement forming layer 39 and the gettering layer 83. In particular, thep⁺ layer 84 is formed, for example, by implanting phosphorus (P) ions ata high energy.

Although the case in which the individual regions are formed in theelement forming layer 39, and the p⁺ layer 84 is then formed isdescribed by way of example, after the p⁺ layer 84 is formed, theindividual regions may be formed in the element forming layer 39.

Next, insulation films and wires are repeatedly formed on the surface ofthe semiconductor substrate main body 32, so that the wiring layer 38 isformed. Subsequently, the semiconductor support substrate 31 made ofsilicon is adhered to the wiring layer 38 with the silicon dioxide layer10 interposed therebetween (see FIG. 12G).

Subsequently, as shown in FIG. 12H, the thin film-forming removal layer50 is removed by a wet etching method, so that the gettering layer 83 isexposed. Since an impurity region which is heavily doped withimpurities, such as boron (B) ions or phosphorus (P) ions, is able tofunction as an etching stopper, the gettering layer 83 functions as anetching stopper in the wet etching.

Next, the shading film 13 is formed on the semiconductor substrate mainbody 32, and a pattern processing is performed on the shading film 13 toform the visible light incident apertures 12 corresponding to the lightreceiving portions. Furthermore, the passivation film 35 is formed onthe shading film 13 by a CVD method, and the color filters 36 and themicrolenses 37 are also formed, so that the solid-state image pick-updevice shown in FIG. 10 can be obtained.

Solid-state image pick-up devices comprising the semiconductor substratemain body 32 of a wafer level are separated into chips by dicing thewafer, and the chips thus separated are each processed by mounting,bonding, and sealing, so that the individual solid-state image pick-updevices can be formed.

In the fourth embodiment, the case in which the gettering layer 83 isused as an etching stopper, and the thin film-forming removal layer 50is removed by etching using a wet etching method is described by way ofexample. However, a wet etching method may not be necessarily used asthe method for removing the thin film-forming removal layer 50, and forexample, the thin film-forming removal layer 50 may be removed by amechanical polishing using a CMP method. The method for removing thethin film-forming removal layer 50 described above may be applied toboth the manufacturing methods (3) and (4) of the solid-state imagepick-up device according to an embodiment of the present invention.

In addition, in the fourth embodiment, the p⁺ layer 84 and the getteringlayer 83 are formed between the element forming layer 39 and the thinfilm-forming removal layer 50, and the thin film-forming removal layer50 is then removed, so that the gettering layer 83 is exposed. However,it is sufficient when the p⁺ layer 84 and the gettering layer 83 can beformed on the upper layer (incident light side) of the element forminglayer 39. Hence, by using the semiconductor substrate main body 32having no thin film-forming removal layer 50, the p⁺ layer 84 and thegettering layer 83 may be formed on the upper layer (incident lightside) of the element forming layer 39. However, since the semiconductorsubstrate main body 32 having no thin film-forming removal layer 50 hasa thickness of approximately 10 μl, it is believed that the handling ofthe semiconductor substrate main body 32 becomes considerably difficultin a manufacturing process. Hence, in consideration of the convenienceof handling the semiconductor substrate main body 32 in a manufacturingprocess, it is believed that by using the semiconductor substrate mainbody 32 including the thin film-forming removal layer 50, the thinfilm-forming removal layer 50 is preferably removed after thesemiconductor support substrate 31 is adhered to the wiring layer 38.The use of the thin film-forming removal layer described above may beapplied to both the manufacturing methods (3) and (4) of the solid-stateimage pick-up device according to an embodiment of the presentinvention.

In the another example of the solid-state image pick-up device accordingto an embodiment of the present invention, since the gettering layer 83is formed, after the thin film-forming removal layer 50 is removed,metal contamination caused by heavy metals can be prevented in variousprocesses.

In addition, since the p⁺ layer 84 is formed, electrons generated due tocrystalline defects of the gettering layer 83 are suppressed fromflowing into the light receiving portion. In particular, even ifelectrons are generated due to crystalline defects of the getteringlayer 83, the electrons thus generated can be combined with holes in thep⁺ layer 84, and as a result, the electrons are suppressed from flowinginto the light receiving portion. Accordingly, noises of the solid-stateimage pick-up device are reduced, and the S/N ratio of the device can beimproved.

5. Fifth Embodiment Structure of a Semiconductor Device

FIG. 13 is a schematic cross-sectional view illustrating another exampleof the semiconductor device according to an embodiment of the presentinvention. The semiconductor device 60 shown in this embodiment is, forexample, RAM, ROM, or LSI and is primarily formed of the semiconductorsupport substrate 61 and the semiconductor substrate main body 62.

The semiconductor substrate main body 62 is formed of n-type silicon. Inaddition, the semiconductor substrate main body 62 has the elementforming layer 65 in which the n-type devices 64, such as a logicelement, an active element, and a passive element, are formed.Furthermore, a p⁺ layer 93, which is an impurity region, is formed onthe element forming layer 65, and a gettering layer 96 is formed on thep⁺ layer 93.

Although the thickness of the semiconductor substrate main body 62changes depending on the type of semiconductor device, the thicknessnecessary for forming a device is approximately 10 μm. In addition, thep⁺ layer 93 is one example of a second conductive type impurity region.

In addition, the wiring layer 67 performing multilayer electrical wiringof the devices 64 is formed on one surface (surface indicated by themark A) of the semiconductor substrate main body 62. In addition, thesemiconductor support substrate 61 is adhered to the wiring layer 67with the silicon dioxide layer 68 interposed therebetween.

The semiconductor support substrate 61 is provided to reinforce thestrength of the semiconductor substrate main body 62 and is formed, forexample, of a silicon substrate, and the thickness thereof is, forexample, approximately 725 μm.

As in the fourth embodiment, the gettering layer 96 may not benecessarily formed on the entire surface of the p⁺ layer 93 and may bepartially formed thereon. However, in consideration of the case in whichthe gettering layer 96 is used as an etching stopper in wet etching asdescribe later, the gettering layer 96 is preferably formed on theentire surface of the p⁺ layer 93.

In addition, as in the fourth embodiment described above, the getteringportions may also be formed in the element forming layer 65 besides thegettering layer 96 formed above the element forming layer 65. However,by the formation of the gettering portion in the element forming layer65, when electrons generated due to crystalline defects of the getteringportion may adversely influence the devices in some cases, the getteringportions are each necessarily formed to ensure a predetermined distancefrom the devices.

In the fifth embodiment, since the device 64 is an n type, the p⁺ layer93, which is a p⁺-type impurity region, is formed. However, when thedevice 64 is a p type, an n⁺ layer, which is an n⁺-type impurity region,is to be formed.

[Manufacturing Method (3) of the Semiconductor Device]

Hereinafter, another method for manufacturing the semiconductor devicehaving the above structure will be described. That is, another exampleof the method for manufacturing the semiconductor device according to anembodiment of the present invention will be described.

In a method (3) for manufacturing the semiconductor device according toan embodiment of the present invention, as shown in FIG. 14A, the device64 is formed in the semiconductor substrate main body 62 which includesthe element forming layer 65 and the thin film-forming removal layer 70.

Subsequently, as shown in FIG. 14B, the p⁺ layer 93 is formed in theelement forming layer 65 at a side of the thin film-forming removallayer 70. In particular, for example, phosphorous (P) ions are implantedat a high energy, so that the p⁺ layer 93 is formed. In addition, asshown in FIG. 14B, the gettering layer 96 is formed in the p⁺ layer 93at the thin film-forming removal layer 70 side. In particular, forexample, after boron (B) ions or phosphorus (P) ions are implanted at ahigh energy, the implanted impurities are activated by a heat treatmentusing an arc lamp annealing device or the like, so that the getteringlayer 96 is formed.

In this embodiment, although the case in which after the device 64 isformed in the element forming layer 65, the p⁺ layer 93 and thegettering layer 96 are formed is described by way of example, the device64 may be formed in the element forming layer 65 after the p⁺ layer 93and the gettering layer 96 are formed.

In addition, although the case in which after the p⁺ layer 93 is formed,the gettering layer 96 is formed is described by way of example, afterthe gettering layer 96 is formed, the p⁺ layer 93 may be formed.

In addition, although the gettering layer 96 is formed in such a waythat after boron (B) ions or phosphorus (P) ions are implanted at a highenergy, the heat treatment is performed using an arc lamp annealingdevice or the like, the method for forming the gettering layer 96 is notlimited to that described above. For example, the gettering layer 96 maybe formed in such a way that after group IV ions, such as carbon ions orSi ions, are implanted, heat diffusion is performed at approximately1,000 to 1,150° C.

Next, insulation films and wires are repeatedly formed on one surface ofthe semiconductor substrate main body 62, so that the wiring layer 67 isformed. Subsequently, the semiconductor support substrate 61 made ofsilicon is adhered to the wiring layer 67 with the silicon dioxide layer68 interposed therebetween (see FIG. 14C).

Subsequently, as shown in FIG. 14D, the thin film-forming removal layer70 is removed by a wet etching method to expose the gettering layer 96,so that the semiconductor device shown in FIG. 13 can be obtained. Inthis wet etching, the gettering layer 96 functions as an etchingstopper.

Semiconductor devices comprising the semiconductor substrate main body62 of a wafer level are separated into chips by dicing the wafer, andthe chips thus separated are each processed by mounting, bonding, andsealing, so that the individual semiconductor devices can be formed.

[Manufacturing Method (4) of the Semiconductor Device]

Hereinafter, another method for manufacturing the semiconductor devicehaving the above structure will be described. That is, another exampleof the method for manufacturing the semiconductor device according to anembodiment of the present invention will be described.

In a method (4) for manufacturing the semiconductor device according toan embodiment of the present invention, as shown in FIG. 14E, when thesemiconductor substrate main body 62 is formed, the gettering layer 96is formed between the element forming layer 65 and the thin film-formingremoval layer 70 of the semiconductor substrate main body 62. Inparticular, for example, after boron (B) ions or phosphorus (P) ions areimplanted at a high energy, the implanted impurities are activated by aheat treatment using an arc lamp annealing device or the like, so thatthe gettering layer 96 is formed.

That is, in the method (3) for manufacturing the semiconductor deviceaccording to an embodiment of the present invention, the gettering layer96 is formed in a wafer process. On the other hand, in the method (4)for manufacturing the semiconductor device according to an embodiment ofthe present invention, the gettering layer 96 is formed in a substratemanufacturing process which is performed before a wafer process.

This method for forming the gettering layer 96 will be described withreference to a particular example.

In general, the semiconductor substrate main body 62 used for asemiconductor device is provided with an epitaxial film (not shown)thereon. In other words, the semiconductor substrate main body 62provided with an epitaxial film grown thereon is variously processed ina wafer process. In the manufacturing method (3) of the semiconductordevice according to an embodiment of the present invention, since thegettering layer 96 is formed in a wafer process, after an epitaxial filmis formed on the semiconductor substrate main body 62, the getteringlayer 96 is formed. On the other hand, in the manufacturing method (4)of the semiconductor device according to an embodiment of the presentinvention, since the gettering layer 96 is formed in a substratemanufacturing process, the gettering layer 96 is formed in thesemiconductor substrate main body 62, and an epitaxial film is thenformed thereon.

Next, as shown in FIG. 14F, the device 64 is formed in the elementforming layer 65 of the semiconductor substrate main body 62.

Subsequently, insulation films and wires are repeatedly formed on onesurface of the semiconductor substrate main body 62, so that the wiringlayer 67 is formed. Next, the semiconductor support substrate 61 made ofsilicon is adhered to the wiring layer 67 with the silicon dioxide layer68 interposed therebetween (see FIG. 14G).

Subsequently, as shown in FIG. 14H, the thin film-forming removal layer70 is removed by a wet etching method to expose the gettering layer 96,so that the semiconductor device shown in FIG. 13 can be obtained.

Semiconductor devices comprising the semiconductor substrate main body62 of a wafer level are separated into chips by dicing the wafer, andthe chips thus separated are each processed by mounting, bonding, andsealing, so that the individual semiconductor devices can be formed.

In this embodiment, as the method for removing the thin film-formingremoval layer 70, a wet etching method may not be necessarily used, andfor example, the thin film-forming removal layer 70 may be removed bymechanical polishing using a CMP method. As in the fourth embodimentdescribed above, the above method for removing the thin film-formingremoval layer 70 may be applied to both the manufacturing methods (3)and (4) of the semiconductor device according to an embodiment of thepresent invention.

In the example of the semiconductor device according to an embodiment ofthe present invention, since the gettering layer 96 is formed, after thethin film-forming removal layer 70 is removed, metal contaminationcaused by heavy metals can be prevented in various processes.

In addition, since the p⁺ layer 93 is formed, electrons generated due tocrystalline defects of the gettering layer 96 are suppressed fromflowing into the device. In particular, even if electrons are generateddue to crystalline defects of the gettering layer 96, the electrons canbe combined with holes of the p⁺ layer 93, and as a result, electronsare suppressed from flowing into the device. Accordingly, noises of thesemiconductor device are reduced.

The present application contains subject matter related to thatdisclosed in Japanese Priority Patent Application JP 2009-026368 filedin the Japan Patent Office on Feb. 6, 2009, the entire content of whichis hereby incorporated by reference.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A solid-state image pick-up device comprising: asemiconductor substrate main body which includes an element forminglayer and a gettering layer provided on an upper layer thereof;photoelectric conversion elements, each of which includes a firstconductive type region, provided in the element forming layer; and adielectric film which is provided on an upper layer of the getteringlayer and which induces a second conductive type region in a surface ofthe gettering layer, wherein the dielectric film has a negative fixedcharge.
 2. The solid-state image pick-up device according to claim 1,wherein the dielectric film is an insulating film which is at leastpartially crystallized.
 3. The solid-state image pick-up deviceaccording to claim 2, wherein the dielectric film is an oxide insulatingfilm which includes an element selected from the group consisting ofhafnium, zirconium, aluminum, tantalum, titanium, yttrium, andlanthanide and which is at least partially crystallized.
 4. Thesolid-state image pick-up device according to claim 1, wherein thedielectric film functions as an antireflection film.
 5. The solid-stateimage pick-up device according to claim 1, further comprising: activeelements which convert signal charges photoelectric-converted by thephotoelectric conversion elements into electrical signals and whichoutput the electrical signals; and a wiring layer which is provided bylamination on the surface of the element forming layer opposite to thegettering layer and which performs wiring of the active elements.
 6. Thesolid-state image pick-up device according to claim 5, furthercomprising: a support substrate layer provided on the surface of thewiring layer opposite to the element forming layer.
 7. The solid-stateimage pick-up device according to one of claim 1, and claims 2 to 6,further comprising: microlenses which are provided on the upper layer ofthe dielectric film and which condense light incident on thephotoelectric conversion elements.
 8. An image pick-up apparatuscomprising: a solid-state image pick-up device including a semiconductorsubstrate main body which has an element forming layer and a getteringlayer provided on an upper layer thereof; photoelectric conversionelements, each of which includes a first conductive type region, formedin the element forming layer; a dielectric film which is provided on anupper layer of the gettering layer and which induces a second conductivetype region in a surface of the gettering layer, wherein the dielectricfilm has a negative fixed charge; an optical system for guiding incidentlight from an object to the solid-state image pick-up device; and asignal processing circuit for processing an output signal from thesolid-state image pick-up device.
 9. A semiconductor device comprising:a semiconductor substrate main body which includes an element forminglayer and a gettering layer provided on an upper layer of the elementforming layer; a device which includes a first conductive type regionand is formed in the element forming layer; and a dielectric film whichis provided on an upper layer of the gettering layer and which induces asecond conductive type region in a surface of the gettering layer,wherein the dielectric film has a negative fixed charge.
 10. Asemiconductor substrate comprising: a semiconductor substrate main bodywhich includes an element forming layer in which a device including afirst conductive type region is provided and a gettering layer providedon an upper layer of the element forming layer; and a dielectric filmwhich is provided on an upper layer of the gettering layer and whichinduced a second conductive type region in a surface of the getteringlayer, wherein the dielectric film has a negative fixed charge.